Thermal and hydraulic modeling
Sinkpath predicts chip temperature, pressure budgets, facility efficiency and device reliability for liquid-cooled datacenters. Cold plate and immersion, single phase and two phase, from geometry and operating conditions. Every branch is checked against published measurements.
Beta model coming out soonTrust me I'm working on it 😭
Heat leaves the die and crosses every interface in turn. Each leg is a resistance the model computes rather than assumes, and each node is a temperature it reports. The compressor is the one leg that runs uphill, which is why the plant is where facility power is won or lost. The same solver returns the pressure budget along the identical path.
Each level owns its own boundary conditions and the geometry of what sits inside it. Change a channel width and the effect travels all the way out to plant power, then comes back as a junction temperature.
The plant is where most of the argument about a cooling design actually happens, so it is modeled as a choice rather than a constant. Each option carries its own approach behaviour, its own parasitic power and its own water draw, and every one of them moves with wet bulb and dry bulb through the year.
Free cooling is not a yes or no answer. For a given supply temperature, a site spends the year moving between full economizer, partial economizer with trim, and full mechanical cooling, and the split is what actually sets annual energy and water. Sinkpath runs the design point and then runs the year, and reports both.
Raising facility water supply by a few degrees usually moves a site between these bands more than any component swap does. That trade is the whole point of running the annual split next to the design point instead of after it.
Each of these comes out of the same solve, so they move together when you change something. PUE on its own hides too much, which is why TUE leads here.
A model is only as good as what you can put into it, so these ship with the tool.
Every one of these libraries is a starting point, not a boundary. Build and test your own materials, coolants and working fluids, define a climate that is not on the list, and enter your own racks, chassis and devices. If the thing you want to model does not exist yet, that is usually the reason you are modeling it.
Most thermal tools stop at temperature and let pump power in through a fixed allowance. Sinkpath derives the circuit from architecture and technology, then solves it: one cold plate and one connector pair per chip section at that section's own flow, pipes and manifolds sized to a design velocity, fixed bore components scaling as flow squared.
Six pressure drop model classes are available per component, from a fixed value to a fitted polynomial, a vendor table or Darcy friction. Components you have not characterized report as unmodeled instead of quietly contributing zero.
A design that passes at the junction temperature limit and a design that sits ten degrees below it are not equivalent, and a pass or fail verdict hides the difference. Sinkpath reports the thermal margin at every node and carries it through to device life, so a cooling choice can be argued on expected reliability rather than on headroom alone.
The same treatment applies to the plant. Approach temperatures, economizer hours and compressor lift all move with the weather, so the annual mode split is reported alongside the design point rather than in place of it.
The same generic solver runs every case, with no per paper calibration and no fitted constants. Each benchmark states which values were fed and which were predicted, shows the substituted arithmetic step by step, and reports error per row with a group RMSE. Falsification cases run alongside: deliberately wrong modeling assumptions are checked to confirm they miss by margins the correct model does not.
Some branches are finished and some are still running. The table says which is which, because a validation table that only lists wins is not a validation table.
| Branch | Reference | Predicted | Agreement | Status |
|---|---|---|---|---|
| Single-phase cold plate | Park et al., IJHMT 2026. Rack level, dry cooler plant | Node ladder 85.03 / 84.03 / 73.03 / 70.60 °C, three pressure budgets, 17 quantities | 0.064 K, 0.011 kPa | Complete |
| Two-phase cold plate | Wang et al., ITherm 2024. Server level R1233zd(E) | Case to fluid resistance 0.0174 against 0.017, exit quality 0.543 against 0.55 | 1.23% | Complete |
| Two-phase cold plate, cross model | Wang, Yuan et al., Appl. Sci. 2023. Rack level | Condenser saturation states, pressure chain, CPU temperature | 0.66%, 5.2%, 1.59 K | Complete |
| Single-phase immersion | Muneeshwaran et al., ICHMT 2023. Single chassis FC-40 tank | Consistency lattice, property web, two independent regime probes | 0.050 K, 0.04% | Complete |
| Facility water reference | LBNL warm water supply reference point | Supply temperature reproduced at 45.1 °C | in window | Complete |
| Two-phase immersion | Pool boiling dataset selection underway | Boiling curve, vapour quality, condenser duty | pending | In progress |
| Hydraulic component library | Vendor curves and published branch data | Component by component pressure drop across the six model classes, and the assembled circuit against a measured branch | partial | In progress |
| Server topology and flow distribution | Series and parallel chassis arrangements | Flow split across parallel branches, per section rise, and the penalty of series arrangements on the last device in the path | partial | In progress |
| Chiller and heat rejection | Manufacturer performance data across the plant options | Part load behaviour, approach against wet and dry bulb, compressor lift and parasitic power | pending | In progress |
| Economizer annual split | Hourly weather against reported site performance | Hours in each mode, annualized PUE and the water balance behind WUE | pending | Next |
Modeling tools tend to claim every technology equally. These four legs are not equally supported, so here is the honest version.
Two findings from that work changed the model itself. In single-phase immersion the fluid heat up resistance belongs at the tank boundary rather than stacked on the local heat transfer coefficient, and stacking it misses by a factor of fifteen. A case to fluid resistance quoted without its reference temperature is ambiguous by up to 39 percent at low flow, so every resistance reported here names inlet, bulk mean or outlet.
If you have a rack you have measured, send the loads, flows and geometry. The useful test is a blind one: hold back the temperatures and the pressures, and see what comes out. Beta access goes out to the people who do this first.