Sinkpath

Thermal and hydraulic modeling

Junction to ambient, in one model.

Sinkpath predicts chip temperature, pressure budgets, facility efficiency and device reliability for liquid-cooled datacenters. Cold plate and immersion, single phase and two phase, from geometry and operating conditions. Every branch is checked against published measurements.

Beta model coming out soon

Trust me I'm working on it 😭

Temperature cascade

Worked example: single-phase cold plate, 1 kW device, chillered plant
AMBIENT 35.0 °C Package Cold plate Caloric CDU approach Compressor lift Heat rejection CHIPJunction59.4 °C PACKAGECase49.4 °C COOLERPlate wall37.4 °C TCSCoolant in35.0 °C CDUFWS supply30.0 °C CHILLERCondenser42.0 °C PLANTAmbient35.0 °C

Heat leaves the die and crosses every interface in turn. Each leg is a resistance the model computes rather than assumes, and each node is a temperature it reports. The compressor is the one leg that runs uphill, which is why the plant is where facility power is won or lost. The same solver returns the pressure budget along the identical path.

The same cascade, at package level

Lidded stack, single-phase cold plate, 1 kW device
Package cross section showing silicon die, TIM, lid or IHS, second TIM and cold plate with their widths and thicknesses, above a resistance network from junction at 55.2 degrees Celsius through case, IHS bottom, IHS, cold plate top and cold plate wall to fluid inlet at 40.0 degrees Celsius, with the resistance of each leg in milli kelvin per watt.
(Not the same case as the system cascade plotted above.) Zoom in on the first leg of the cascade and the same treatment applies: every layer of the stack is a resistance with a temperature either side of it, drawn from the geometry you entered rather than lumped into a single junction-to-case figure. Two legs carry most of the budget here, spreading through the lid at 4.01 mK/W and the fluid itself at 8.95 mK/W, and everything else sits under half a kelvin. Splitting the stack out is what makes that visible.
Levels

Seven control volumes, one continuous solve.

Each level owns its own boundary conditions and the geometry of what sits inside it. Change a channel width and the effect travels all the way out to plant power, then comes back as a junction temperature.

01PackageDie, lid or bare die, TIM stack, spreading and conduction. Or a measured junction-to-case resistance entered as a single value, a flow curve, a polynomial or an itemized series.
02ServerCold plates or immersion heat sinks per chip section, heterogeneous loads, quick disconnects, and the branch hydraulics along each flow path.
03RackManifolds, series and parallel composition, and pairing rules that block incompatible hardware rather than warning about it.
04TCSThe technology cooling system loop. Single phase or two phase, cold plate or immersion, with the fluid library and design rise that set the caloric floor.
05CDUEffectiveness NTU on liquid exchangers, condensing form when the secondary side boils, and off-rating UA scaling from the vendor rating point.
06Hall and facility waterRoom level aggregation, facility water supply and return, glycol fraction, loop pressure and treatment.
07PlantHeat rejection and economizer staging, sized against the climate the hall actually sits in. Returns TUE, PUE and WUE.
Plant

Pick the rejection path, then let the weather decide the duty.

The plant is where most of the argument about a cooling design actually happens, so it is modeled as a choice rather than a constant. Each option carries its own approach behaviour, its own parasitic power and its own water draw, and every one of them moves with wet bulb and dry bulb through the year.

Water-cooled chillerCompressor lift against a condenser loop, with part load behaviour and a lift that follows condenser water temperature.
Air-cooled chillerNo tower, no water draw, and a condensing temperature tied directly to dry bulb. Usually the PUE penalty and the WUE win at the same time.
Open cooling towerWet bulb approach, evaporative loss, drift and blowdown carried explicitly into the water balance.
Closed circuit towerIsolated process loop with an evaporative outer circuit, for sites that want tower performance without exposing the facility water.
Dry coolerDry bulb approach, zero water. The reference case for warm water designs that never need a compressor.
Adiabatic coolerDry most of the year, pre-cooled on the hot hours only. Water is spent where it buys the most approach.
Heat pumpLift taken deliberately rather than reluctantly, to raise return water to a temperature something else can use.
GeothermalGround or groundwater loop as a stable low temperature sink, sized on soil conditions rather than air.
Radiative sky and cool roofLongwave rejection to the sky and surface treatments, both strongly climate dependent and both reported as hours rather than as a rating.

Economizer duty, by climate.

Free cooling is not a yes or no answer. For a given supply temperature, a site spends the year moving between full economizer, partial economizer with trim, and full mechanical cooling, and the split is what actually sets annual energy and water. Sinkpath runs the design point and then runs the year, and reports both.

Full economizer hoursAmbient cold enough that the compressor stays off and the approach alone carries the load.
Partial with mechanical trimEconomizer takes what it can, the chiller makes up the difference, and the lift is only as large as the shortfall.
Full mechanicalDesign day behaviour, which sets equipment size even when it represents a small fraction of the year.

Raising facility water supply by a few degrees usually moves a site between these bands more than any component swap does. That trade is the whole point of running the annual split next to the design point instead of after it.

Metrics

The efficiency numbers, computed rather than quoted.

Each of these comes out of the same solve, so they move together when you change something. PUE on its own hides too much, which is why TUE leads here.

TUETotal power usage effectivenessFacility power and the cooling power spent inside the IT equipment itself, counted together. Fans and on-board pumps are cooling energy no matter which side of the rack door they sit on, and TUE is the only one of these that says so.
PUEPower usage effectivenessTotal facility power over IT power, reported at the design point and as an annualized value across the economizer split.
EREEnergy reuse effectivenessCredit for heat actually exported and used elsewhere, which is where the heat pump option stops being a penalty and starts being the reason for the design.
WUEWater usage effectivenessLitres per kilowatt hour, built from evaporation, drift and blowdown rather than from a rule of thumb. Goes to zero on the dry options, which is the trade worth seeing next to PUE.
CUECarbon usage effectivenessCarbon per unit of IT energy, following the grid the site is actually on rather than a national average.
Libraries

Real hardware, not placeholder properties.

A model is only as good as what you can put into it, so these ship with the tool.

65 and countingMaterialsConventional and exotic, including the high conductivity substrates and advanced interface materials that only matter once flux gets high enough to notice them.
8Vendor serversReal chassis definitions with their published thermal and flow characteristics, rather than a generic rack unit.
10NVIDIA, AMD and Intel devicesPackage geometry, power and junction limits for current accelerators and CPUs, so a comparison starts from the device you are actually deploying.
3Immersion tanksTanks with the server configurations that go in them, since neither one means much without the other.
71Working fluidsWater and glycol mixtures, dielectrics and refrigerants, with temperature dependent properties rather than single point values.
27 and countingClimatesHourly weather for the economizer split, so the annual answer belongs to the site rather than to a category.
And these are only the defaults

Every one of these libraries is a starting point, not a boundary. Build and test your own materials, coolants and working fluids, define a climate that is not on the list, and enter your own racks, chassis and devices. If the thing you want to model does not exist yet, that is usually the reason you are modeling it.

Hydraulics

Pressure is modeled, not assumed.

Most thermal tools stop at temperature and let pump power in through a fixed allowance. Sinkpath derives the circuit from architecture and technology, then solves it: one cold plate and one connector pair per chip section at that section's own flow, pipes and manifolds sized to a design velocity, fixed bore components scaling as flow squared.

Six pressure drop model classes are available per component, from a fixed value to a fitted polynomial, a vendor table or Darcy friction. Components you have not characterized report as unmodeled instead of quietly contributing zero.

Waterfall chart of cumulative pressure drop across the technology cooling loop. Package 77.1 kPa, server 11.8 kPa, CDU TCS side 77.1 kPa, rack 10.2 kPa, room shown as not modelled. Total 176.2 kPa across four modelled stages.
Cumulative pressure drop along the technology cooling loop, in flow order. Stages the model does not compute are drawn as grey gaps rather than as zero, so an incomplete budget reads as incomplete.
Reliability

Temperature is a lifetime, not just a limit.

A design that passes at the junction temperature limit and a design that sits ten degrees below it are not equivalent, and a pass or fail verdict hides the difference. Sinkpath reports the thermal margin at every node and carries it through to device life, so a cooling choice can be argued on expected reliability rather than on headroom alone.

The same treatment applies to the plant. Approach temperatures, economizer hours and compressor lift all move with the weather, so the annual mode split is reported alongside the design point rather than in place of it.

Validation

One algorithm, checked branch by branch.

The same generic solver runs every case, with no per paper calibration and no fitted constants. Each benchmark states which values were fed and which were predicted, shows the substituted arithmetic step by step, and reports error per row with a group RMSE. Falsification cases run alongside: deliberately wrong modeling assumptions are checked to confirm they miss by margins the correct model does not.

Some branches are finished and some are still running. The table says which is which, because a validation table that only lists wins is not a validation table.

0.064 KRMSE across 11 thermal predictions, 0.19 percent of the 33.19 K driving span
66xDiscrimination ratio, how far wrong assumptions miss against the model's own error
4Cooling technologies carried by one branching algorithm
Benchmark status
BranchReferencePredictedAgreementStatus
Single-phase cold plate Park et al., IJHMT 2026. Rack level, dry cooler plant Node ladder 85.03 / 84.03 / 73.03 / 70.60 °C, three pressure budgets, 17 quantities 0.064 K, 0.011 kPa Complete
Two-phase cold plate Wang et al., ITherm 2024. Server level R1233zd(E) Case to fluid resistance 0.0174 against 0.017, exit quality 0.543 against 0.55 1.23% Complete
Two-phase cold plate, cross model Wang, Yuan et al., Appl. Sci. 2023. Rack level Condenser saturation states, pressure chain, CPU temperature 0.66%, 5.2%, 1.59 K Complete
Single-phase immersion Muneeshwaran et al., ICHMT 2023. Single chassis FC-40 tank Consistency lattice, property web, two independent regime probes 0.050 K, 0.04% Complete
Facility water reference LBNL warm water supply reference point Supply temperature reproduced at 45.1 °C in window Complete
Two-phase immersion Pool boiling dataset selection underway Boiling curve, vapour quality, condenser duty pending In progress
Hydraulic component library Vendor curves and published branch data Component by component pressure drop across the six model classes, and the assembled circuit against a measured branch partial In progress
Server topology and flow distribution Series and parallel chassis arrangements Flow split across parallel branches, per section rise, and the penalty of series arrangements on the last device in the path partial In progress
Chiller and heat rejection Manufacturer performance data across the plant options Part load behaviour, approach against wet and dry bulb, compressor lift and parasitic power pending In progress
Economizer annual split Hourly weather against reported site performance Hours in each mode, annualized PUE and the water balance behind WUE pending Next
Coverage

What is anchored, and what is not.

Modeling tools tend to claim every technology equally. These four legs are not equally supported, so here is the honest version.

Single-phase cold plateExperimental anchor, Park 2026
Two-phase cold plateExperimental and cross model anchors
Single-phase immersionExperimental anchor, Muneeshwaran 2023
Two-phase immersionStructural only, experimental anchor pending

Two findings from that work changed the model itself. In single-phase immersion the fluid heat up resistance belongs at the tank boundary rather than stacked on the local heat transfer coefficient, and stacking it misses by a factor of fifteen. A case to fluid resistance quoted without its reference temperature is ambiguous by up to 39 percent at low flow, so every resistance reported here names inlet, bulk mean or outlet.

Who

Built inside a thermofluidics research group.

Muhammad Usama Ph.D. Candidate, University of Texas at Austin Datacenter cooling and waste heat recovery. Author of the model and of the benchmark harnesses behind every number on this page. LinkedIn
Vaibhav Bahadur Faculty advisor, University of Texas at Austin Advises the research program behind Sinkpath and the peer reviewed work the model is built on.

Try it against your own data.

If you have a rack you have measured, send the loads, flows and geometry. The useful test is a blind one: hold back the temperatures and the pressures, and see what comes out. Beta access goes out to the people who do this first.